Widely used in manual dip soldering and wave soldering of military products, electrical and electronic products, high-end electronic products, home appliances, automotive electronics, and industrial electrical products; developed after adding a small amount of precious metal elements for proportioning The special tin bar / tin wire products are also suitable for manual dip soldering and wave soldering of electronic component feet, wire materials, PCB boards and other products.




Product number
Product ingredients
Melting point
other



6337


Sn63% Pb37%


183℃

Can be made into strips/silks



3565


Sn35% Pb65%


320-380℃




6040


Sn60% Pb40%


183-190℃




4060


Sn40% Pb60%


183-238℃





 

Widely used in manual dip soldering and wave soldering of military industry, precision electronic instruments, precision medical equipment, high-end electronic products, automotive electronics and other products; special tin bars/wires developed after adding trace precious metal elements for proportioning The product is also suitable for manual dip soldering and wave soldering of electronic component feet, wire materials, PCB boards and other products.




category
Product number
Product ingredients
Product specifications
 
Melting point


Tin

SnAg0.3Cu0.7


Sn99.0% Ag0.3% Cu0.7%


327*20.5*17.3mm

 

217-227℃




SnAg3.0Cu0.5


Sn96.5% Ag3.0% Cu0.5%


327*20.5*17.3mm

 

217-220℃




SnAg3.0


SnAg3.0


327*20.5*17.3mm

 

221-224℃




SnAg0.3


Sn99.7% Ag0.3%


327*20.5*17.3mm

 

210-215℃




SnCu0.7


Sn99.3% Cu0.7%


327*20.5*17.3mm

 

227℃



Tin wire

SnAg3.0Cu0.5


Sn96.5% Ag3.0% Cu0.5%


0.8~2.0mm

 

217-227℃




SnAg0.3Cu0.7


Sn99.0% Ag0.3% Cu0.7%


0.8~2.0mm

 

217-220℃




SnAg0.3


Sn99.7% Ag0.3%


0.8~2.0mm

 

221-224℃




SnCu0.7


Sn99.3 Cu0.7%


0.8~2.0mm

 

227℃




SnAg3.0


Sn97% Ag3%


0.8~2.0mm

 

210-215℃





 

BGA solder balls are used for special solder balls on the soldering board before soldering the integrated circuits of the BGA package. The specific method of use is to cover the BGA tin mesh with the solder paste applied to the newly purchased chip, place the BGA tin ball, blow with the hot air gun, and take out the BGA tin mesh after soldering on the chip, and use the BGA soldering station to bring the BGA tin The ball chip is soldered on the circuit board.

Note: All product specifications, sizes and ingredients support customization




Product number
Product ingredients
Product specifications
Melting point



SnAg2.0Cu0.5


Sn97.5% Ag2.0% Cu0.5%


0.05-0.76mm（customizable）


217-223℃




SnAg1.0Cu0.5


Sn98.5% Ag1.0% Cu0.5%


0.05-0.76mm（customizable）


217-227℃




SnAg3.0Cu0.5


Sn96.5% Ag3.0% Cu0.5%


0.05-0.76mm（customizable）


217-220℃




SnAg0.3Cu0.7


Sn99.0% Ag0.3% Cu0.7%


0.05-0.76mm（customizable）


217-227℃




Sn63Pb37


Sn63% Pb37%


0.05-0.76mm（customizable）


200-210℃




SnCu0.7


Sn99.3% Cu0.7%


0.05-0.76mm（customizable）


227℃




SnAg3.0


Sn97% Ag3%


0.05-0.76mm（customizable）


221-224℃




SnAg0.3


Sn99.7% Ag0.3%


0.05-0.76mm（customizable）


210-215℃