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Copper-based brazing paste
Phosphorus-containing copper-based solder paste is suitable for brazing red copper, copper alloys, silver alloys, etc. The solder paste has good wettability with the base metal to be welded, and the welding strength is excellent. However, phosphorus-containing copper-based solder paste has poor wettability to metal alloys such as iron or nickel, and it is easy to form brittle phosphides at the joint, which increases the brittleness of the joint. It is recommended to use other types of solder paste.
Copper-based solder paste | Element/wt.% | Melting range/℃ | applicability | |||||
Ag | Cu | Sn | Ni | P | Ti | |||
FK-CuSnPNi | - | margin | 7.0~8.0 | 0.4~1.2 | 4.8-5.8 | - | 590~630 |
Low melting point, copper, copper |
FK-CuPSn | - | margin | 2.0~4.0 | - | 6.3~7.0 | - | 690~720 | |
FK-CuSnTi | - | margin | 15.0~20.0 | - | - | 9.0~10.0 | 850~890 | Diamond brazing, vacuum brazing |
FK-Ag5CuP | 4.8-5.2 | margin | - | - | 6.5~7.0 | - | 643~771 |
Silver-containing copper-phosphorus solder |
FK-Agl5CuP | 14.5~15.5 | margin | - | - | 4.8~5.2 | - | 670~800 | |
FK-Agl8CuP | 17.0~19.0 | margin | - | - | 6.6-7.5 | - | 650~680 |

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