What are the conditions for electronic solder in soldering solder?
Release time:
2022-10-21
【Summary Description】 Electronic solder is a general term for metal alloy materials used for welding, surfacing and brazing joints. It includes welding wire (welding wire), welding rod (welding rod) and solder (brazing and brazing alloy). The melting temperature of welding solder is usually not lower than the solidus of the base metal, and its chemical composition, mechanical properties and thermal properties are close to the base metal, such as various welding rods, flux-cored wires, etc. The weld strength is usually not lower than the base metal itself, and the melting temperature of the brazing filler metal must be lower than the solidus of the base metal. The chemical composition of the brazing filler metal is often far away from the base metal, the brazing weld is small and the size is accurate, but the strength of the brazing weld is mostly not as good as the base metal itself, and the corrosion resistance is poor. Solder, such as arc welding, often exceeds the base material and the solder itself, and does not have soft and hard parts. Copper, zinc (copper-zinc alloy), silver solder (silver-copper alloy) and other brazing joints are firm, mainly used for high-strength joints, brazing materials (tin-lead) and other brazing materials. The main alloy welded joints have low strength and are mainly used to connect small joints that do not require excessive strength, such as electronic instruments, meters, and electrical wires. The main function of the solder is to connect the weld and form a channel for the circuit. electronic solder with the conditions: 1) The melting point of the solder is lower than that of the welding machine. 2) It is easy to combine with the weld and must have a certain compression capacity. 3) Must have good conductivity. 4) Must have a faster crystallization rate.
Electronic solder is a general term for metal alloy materials used for welding, surfacing and brazing joints. It includes welding wire (welding wire), welding rod (welding rod) and solder (brazing and brazing alloy).
The melting temperature of welding solder is usually not lower than the solidus of the base metal, and its chemical composition, mechanical properties and thermal properties are close to the base metal, such as various welding rods, flux-cored wires, etc. The weld strength is usually not lower than the base metal itself, and the melting temperature of the brazing filler metal must be lower than the solidus of the base metal. The chemical composition of the brazing filler metal is often far away from the base metal, the brazing weld is small and the size is accurate, but the strength of the brazing weld is mostly not as good as the base metal itself, and the corrosion resistance is poor.

Solder, such as arc welding, often exceeds the base material and the solder itself, and does not have soft and hard parts. Copper, zinc (copper-zinc alloy), silver solder (silver-copper alloy) and other brazing joints are firm, mainly used for high-strength joints, brazing materials (tin-lead) and other brazing materials.
The main alloy welded joints have low strength and are mainly used to connect small joints that do not require excessive strength, such as electronic instruments, meters, and electrical wires. The main function of the solder is to connect the weld and form a channel for the circuit. electronic solder with the conditions:
1) The melting point of the solder is lower than that of the welding machine.
2) It is easy to combine with the weld and must have a certain compression capacity.
3) Must have good conductivity.
4) Must have a faster crystallization rate.
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