Improving materials and processes is the key to solving welding reliability and failure defects
Release time:
2022-10-24
【Summary Description】 Lead-free and lead-free solder joints are different in appearance. At the same time, lead-free solder joints in spherical solder joints are increased, so the testing requirements for equipment have been improved. In the reliability test of lead-free process solder joints, it is more important to carry out temperature-dependent fatigue tests for the different thermal expansion coefficients of solder joints and connecting components. Including isothermal mechanical fatigue test, thermal fatigue test and corrosion resistance test. According to the test results, it can be confirmed that different lead-free materials have different resistance to mechanical stress at the same temperature, and studies have shown that different lead-free materials show different failure mechanisms and failure patterns. Lead-free solder joint reliability test, mainly for electronic assembly products thermal load test (temperature shock or temperature cycle test); according to the fatigue life test conditions for the combination of electronic devices for mechanical stress testing; use the model for life evaluation, the current more famous model has low cycle fatigue Coffin-Manson model, generally consider the average temperature and frequency of the use of modified Coffin-Manson model, the Coffin-Manson model is used when considering the temperature characteristics and creep relationship of the material. Lead-free solder joint reliability test methods mainly include appearance inspection, X-ray inspection, metallographic section analysis, strength (tensile, shear), fatigue life, high temperature and high humidity, drop test, random vibration, etc. For manufacturers, reliability is a relatively high-level consideration, but the manufacturing process is still the most basic, there is no manufacturing process there is no reliability. Therefore, improving materials and processes is the key to solving the reliability and failure defects of lead-free soldering.
Lead-free and lead-free solder joints are different in appearance. At the same time, lead-free solder joints in spherical solder joints are increased, so the testing requirements for equipment have been improved.
In the reliability test of lead-free process solder joints, it is more important to carry out temperature-dependent fatigue tests for the different thermal expansion coefficients of solder joints and connecting components. Including isothermal mechanical fatigue test, thermal fatigue test and corrosion resistance test. According to the test results, it can be confirmed that different lead-free materials have different resistance to mechanical stress at the same temperature, and studies have shown that different lead-free materials show different failure mechanisms and failure patterns.
Lead-free solder joint reliability test, mainly for electronic assembly products thermal load test (temperature shock or temperature cycle test); according to the fatigue life test conditions for the combination of electronic devices for mechanical stress testing; use the model for life evaluation, the current more famous model has low cycle fatigue Coffin-Manson model, generally consider the average temperature and frequency of the use of modified Coffin-Manson model, the Coffin-Manson model is used when considering the temperature characteristics and creep relationship of the material.
Lead-free solder joint reliability test methods mainly include appearance inspection, X-ray inspection, metallographic section analysis, strength (tensile, shear), fatigue life, high temperature and high humidity, drop test, random vibration, etc.
For manufacturers, reliability is a relatively high-level consideration, but the manufacturing process is still the most basic, there is no manufacturing process there is no reliability. Therefore, improving materials and processes is the key to solving the reliability and failure defects of lead-free soldering.
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