Analysis of the process performance and influencing factors of electronic solder (below)
Release time:
2022-09-30
【Summary Description】 (2) Oxidation resistance of liquid solder That is, at a certain temperature, the ability of liquid solder to resist oxidation reaction. The oxidation of molten solder will not only cause serious waste of metal, but also the oxide film will hinder the combination between the solder and the base metal surface atoms, and will also cause the oxide film to enter the weld to produce various welding defects. According to the theory of liquid metal oxidation, the surface of liquid solder will strongly adsorb oxygen. The adsorbed oxygen molecules will decompose into oxygen atoms at high temperature, and the oxygen atoms will lose electrons and become ions, and then combine with metal ions to form metal oxides. The composition and structure of the oxide film are different, and the growth rate, growth mode and distribution coefficient of the oxide in liquid solder will be very large. This, in turn, is closely related to the composition of the solder. In addition, the oxidation is also related to the temperature, the partial pressure of oxygen in the gas phase, the adsorption and decomposition rate of oxygen on the surface of the solder, the combination ability of surface atoms and oxygen, the density of the surface oxide film, and the dissolution and diffusion ability of the product. (3) Wetting properties of liquid solder That is, at a certain temperature, the liquid solder produces wetting speed and wetting force on the base material. Poor wetting performance will lead to brazing difficulties, prone to false welding, false welding, and desoldering, which directly affect the mechanical and electrical properties of the brazed joints, resulting in poor signal transmission, information distortion, poor sensitivity, and reduced reliability. (4) Diffusivity of liquid solder That is, the ability of liquid solder to flow and expand on the surface of the base metal at a certain temperature. The diffusivity and wettability of liquid solder are closely related, but there are differences. Diffusivity is the comprehensive performance of wettability and fluidity of liquid solder. In the soldering process, for example, the poor diffusion of liquid solder will cause the solder to expand insufficiently in the area to be soldered or create a void in the weld, reducing the bonding area, and also easily causing the solder joint or weld to bridge or pull the tip to cause a short circuit. Clearly, both wetting and oxidation factors have an effect on diffuse flow.
(2) Oxidation resistance of liquid solder
That is, at a certain temperature, the ability of liquid solder to resist oxidation reaction. The oxidation of molten solder will not only cause serious waste of metal, but also the oxide film will hinder the combination between the solder and the base metal surface atoms, and will also cause the oxide film to enter the weld to produce various welding defects. According to the theory of liquid metal oxidation, the surface of liquid solder will strongly adsorb oxygen. The adsorbed oxygen molecules will decompose into oxygen atoms at high temperature, and the oxygen atoms will lose electrons and become ions, and then combine with metal ions to form metal oxides. The composition and structure of the oxide film are different, and the growth rate, growth mode and distribution coefficient of the oxide in liquid solder will be very large. This, in turn, is closely related to the composition of the solder. In addition, the oxidation is also related to the temperature, the partial pressure of oxygen in the gas phase, the adsorption and decomposition rate of oxygen on the surface of the solder, the combination ability of surface atoms and oxygen, the density of the surface oxide film, and the dissolution and diffusion ability of the product.
(3) Wetting properties of liquid solder
That is, at a certain temperature, the liquid solder produces wetting speed and wetting force on the base material. Poor wetting performance will lead to brazing difficulties, prone to false welding, false welding, and desoldering, which directly affect the mechanical and electrical properties of the brazed joints, resulting in poor signal transmission, information distortion, poor sensitivity, and reduced reliability.
(4) Diffusivity of liquid solder
That is, the ability of liquid solder to flow and expand on the surface of the base metal at a certain temperature. The diffusivity and wettability of liquid solder are closely related, but there are differences. Diffusivity is the comprehensive performance of wettability and fluidity of liquid solder. In the soldering process, for example, the poor diffusion of liquid solder will cause the solder to expand insufficiently in the area to be soldered or create a void in the weld, reducing the bonding area, and also easily causing the solder joint or weld to bridge or pull the tip to cause a short circuit. Clearly, both wetting and oxidation factors have an effect on diffuse flow.
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