Why has the soldering process endured and will continue in the future?
Release time:
2023-01-01
【Summary Description】 There are three compelling reasons: (1) Stress connection: At room temperature, pure solder is a plastic self-annealing alloy, which can absorb stress under the condition of work hardening phenomenon or fatigue damage due to stress cycling. This unique property makes it possible to join materials with different coefficients of expansion, rigidity and strength without imposing some of the typical technical requirements of mechanical assemblies. For example, the design of printed circuit boards violates all structural design principles related to stress concentration, material strength, load distribution and vibration resistance. Without the solder connection method and its stress connection ability, it is impossible to have the well-known printed circuit board today; if other stress yield welding methods, such as brazing or other welding methods, may cause damage to the laminate, The circuit shedding and the failure of the glass-metal intermetallic seal of the components on the board. (2) Reliability: Because soldering can be welded at a lower temperature (below 450°C), the plastic and the welded components are usually not deformed and degraded due to heat. (3) Economy: The soldering method is particularly economical because of the simple equipment used for soldering, the low cost of materials and the controllable soldering process. In the near future, as long as we also use wires, semiconductor devices and insulating materials, based on the principle of electrical and magnetic pulses to manufacture circuits, soldering is an essential technical means. In general, the durability of soldering depends on the ability of the welding process to absorb process stress during product processing and product service; the ability to control the quality of the welded parts without causing damage during the welding process; and the ability to facilitate welding at low cost. (The point of view of this article comes from "1100 Questions on the Application of Modern Electronic Joint Engineering")
There are three compelling reasons:
(1) Stress connection: At room temperature, pure solder is a plastic self-annealing alloy, which can absorb stress under the condition of work hardening phenomenon or fatigue damage due to stress cycling. This unique property makes it possible to join materials with different coefficients of expansion, rigidity and strength without imposing some of the typical technical requirements of mechanical assemblies. For example, the design of printed circuit boards violates all structural design principles related to stress concentration, material strength, load distribution and vibration resistance. Without the solder connection method and its stress connection ability, it is impossible to have the well-known printed circuit board today; if other stress yield welding methods, such as brazing or other welding methods, may cause damage to the laminate, The circuit shedding and the failure of the glass-metal intermetallic seal of the components on the board.
(2) Reliability: Because soldering can be welded at a lower temperature (below 450°C), the plastic and the welded components are usually not deformed and degraded due to heat.
(3) Economy: The soldering method is particularly economical because of the simple equipment used for soldering, the low cost of materials and the controllable soldering process.
In the near future, as long as we also use wires, semiconductor devices and insulating materials, based on the principle of electrical and magnetic pulses to manufacture circuits, soldering is an essential technical means.
In general, the durability of soldering depends on the ability of the welding process to absorb process stress during product processing and product service; the ability to control the quality of the welded parts without causing damage during the welding process; and the ability to facilitate welding at low cost.
(The point of view of this article comes from "1100 Questions on the Application of Modern Electronic Joint Engineering")
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