The 8th China (Hangzhou) Green Connection and Manufacturing 2024 Summit Forum Held
Release time:
2024-10-23
【Summary Description】 On October 21, the 2024 International Brazing, Diffusion Welding and Micro-nano Connection Conference and the 8th China (Hangzhou) Green Connection and Manufacturing 2024 Summit Forum opened successfully in Hangzhou, Zhejiang Province. From October 21 to 23, the conference focused on advanced brazing materials and brazing technology, diffusion welding technology, micro-nano connection new technology and application of three directions to carry out conference reports, branch theme reports and other academic exchange activities. At the meeting, experts from all walks of life discussed the theoretical and technical exploration in the fields of brazing, diffusion welding and micro-nano connection, promoting the exchange and integration of production, teaching and research, and helping the high-quality development of the industry. The conference was hosted by the Welding Branch of the Chinese Society of Mechanical Engineering (hereinafter referred to as the "Welding Branch"), Hangzhou Huaguang Welding New Materials Co., Ltd., Zhejiang University of Technology, National Key Laboratory of Precision Welding and Connection of Material Structures, New Brazing Materials and Technology State Key Laboratory, Tsinghua University, Beijing University of Technology jointly organized. In June 2014, the Welding Branch of the Chinese Mechanical Engineering Society successfully held the "International Conference on Brazing and Special Connection Technology" in Beijing. After a lapse of ten years, the Welding Branch held such an international conference again. According to industry insiders, brazing, diffusion welding and micro-nano connection technologies have been playing an important role in a wide range of fields such as aerospace, transportation, new energy, semiconductors, integrated circuits, and high-end manufacturing. According to reports, a total of experts, scholars, scientific and technological personnel and business representatives from more than ten countries at home and abroad in the fields of brazing, diffusion welding and advanced packaging micro-nano connections attended the meeting. Participants conducted in-depth exchanges on cutting-edge research and future development in related fields, focusing on the opportunities and challenges faced by brazing, diffusion welding and micro-nano connections under the background of "carbon peak and carbon neutrality" to promote discipline development, Talent training, technological progress and industrial upgrading. As the key content of the meeting, after the opening ceremony, the meeting held 7 special invited reports, including using electrostatic jet deflection system to improve the printing speed of electrofluid jet printing, the basic principle and solution of hard alloy brazing, the latest progress of surface activated bonding for heterogeneous material bonding, B- class conductive adhesive in advanced electronic packaging technology, nano-connection and micro-nano device integration. On the afternoon of October 21, Huaguang New Materials held a green connection and manufacturing summit forum with the theme of "artificial intelligence integration and innovation. According to reports, artificial intelligence is an important driving force for the new round of technological revolution and industrial transformation, which will bring many new industrial opportunities. Welding and connecting materials and corresponding technologies are also closely related to the development of artificial intelligence. The summit forum specially invited 8 senior experts at home and abroad to exchange views on the topics of artificial intelligence design, welding robot application, artificial intelligence-related electronic and micro-nano connection material innovation, future brazing and micro-nano connection material technology and industrial direction in the Welding materials. From October 22 to 23, the conference will arrange more than 60 academic exchange reports in the two sub-venues of brazing and diffusion welding and micro-nano connection. Among them, brazing and diffusion welding mainly involve discussions on topics such as multi-main element brazing materials facing brazing challenges, wetting and interface reaction of high-entropy carbide ceramics, basic principles and applications of diffusion welding and the latest inventions, research progress of ultrasonic assisted brazing, and multi-energy field hybrid welding and brazing technology of dissimilar metals; the micro-nano connection sub-venue mainly involves discussions on the properties of nanomaterials for low-temperature welding, the mechanism of solder joints in electronic packaging structures, the 3D integrated high-flux bonding technology of nanoparticles, the ultra-fast laser packaging technology of semiconductor materials, the new interconnection materials and technologies for IC packaging, and the advanced packaging technology of copper paste technology. The relevant person in charge of Huaguang New Materials said that this conference is of great significance to enhance the international competitiveness, academic influence and innovation guidance of my country's brazing, diffusion welding and micro-nano connection technology. Huaguang New Materials looks forward to continuing to work with experts, scholars and industrial chains at home and abroad through the platform of Green Connection and Manufacturing Summit Forum in the future to jointly promote technological progress and high-quality development of the industry and help the development of new quality productivity.
On October 21, the 2024 International Brazing, Diffusion Welding and Micro-nano Connection Conference and the 8th China (Hangzhou) Green Connection and Manufacturing 2024 Summit Forum opened successfully in Hangzhou, Zhejiang Province. From October 21 to 23, the conference focused on advanced brazing materials and brazing technology, diffusion welding technology, micro-nano connection new technology and application of three directions to carry out conference reports, branch theme reports and other academic exchange activities. At the meeting, experts from all walks of life discussed the theoretical and technical exploration in the fields of brazing, diffusion welding and micro-nano connection, promoting the exchange and integration of production, teaching and research, and helping the high-quality development of the industry.
The conference was hosted by the Welding Branch of the Chinese Society of Mechanical Engineering (hereinafter referred to as the "Welding Branch"), Hangzhou Huaguang Welding New Materials Co., Ltd., Zhejiang University of Technology, National Key Laboratory of Precision Welding and Connection of Material Structures, New Brazing Materials and Technology State Key Laboratory, Tsinghua University, Beijing University of Technology jointly organized. In June 2014, the Welding Branch of the Chinese Mechanical Engineering Society successfully held the "International Conference on Brazing and Special Connection Technology" in Beijing. After a lapse of ten years, the Welding Branch held such an international conference again.
According to industry insiders, brazing, diffusion welding and micro-nano connection technologies have been playing an important role in a wide range of fields such as aerospace, transportation, new energy, semiconductors, integrated circuits, and high-end manufacturing. According to reports, a total of experts, scholars, scientific and technological personnel and business representatives from more than ten countries at home and abroad in the fields of brazing, diffusion welding and advanced packaging micro-nano connections attended the meeting. Participants conducted in-depth exchanges on cutting-edge research and future development in related fields, focusing on the opportunities and challenges faced by brazing, diffusion welding and micro-nano connections under the background of "carbon peak and carbon neutrality" to promote discipline development, Talent training, technological progress and industrial upgrading.
As the key content of the meeting, after the opening ceremony, the meeting held 7 special invited reports, including using electrostatic jet deflection system to improve the printing speed of electrofluid jet printing, the basic principle and solution of hard alloy brazing, the latest progress of surface activated bonding for heterogeneous material bonding, B- class conductive adhesive in advanced electronic packaging technology, nano-connection and micro-nano device integration.
On the afternoon of October 21, Huaguang New Materials held a green connection and manufacturing summit forum with the theme of "artificial intelligence integration and innovation. According to reports, artificial intelligence is an important driving force for the new round of technological revolution and industrial transformation, which will bring many new industrial opportunities. Welding and connecting materials and corresponding technologies are also closely related to the development of artificial intelligence. The summit forum specially invited 8 senior experts at home and abroad to exchange views on the topics of artificial intelligence design, welding robot application, artificial intelligence-related electronic and micro-nano connection material innovation, future brazing and micro-nano connection material technology and industrial direction in the Welding materials.
From October 22 to 23, the conference will arrange more than 60 academic exchange reports in the two sub-venues of brazing and diffusion welding and micro-nano connection. Among them, brazing and diffusion welding mainly involve discussions on topics such as multi-main element brazing materials facing brazing challenges, wetting and interface reaction of high-entropy carbide ceramics, basic principles and applications of diffusion welding and the latest inventions, research progress of ultrasonic assisted brazing, and multi-energy field hybrid welding and brazing technology of dissimilar metals; the micro-nano connection sub-venue mainly involves discussions on the properties of nanomaterials for low-temperature welding, the mechanism of solder joints in electronic packaging structures, the 3D integrated high-flux bonding technology of nanoparticles, the ultra-fast laser packaging technology of semiconductor materials, the new interconnection materials and technologies for IC packaging, and the advanced packaging technology of copper paste technology.
The relevant person in charge of Huaguang New Materials said that this conference is of great significance to enhance the international competitiveness, academic influence and innovation guidance of my country's brazing, diffusion welding and micro-nano connection technology. Huaguang New Materials looks forward to continuing to work with experts, scholars and industrial chains at home and abroad through the platform of Green Connection and Manufacturing Summit Forum in the future to jointly promote technological progress and high-quality development of the industry and help the development of new quality productivity.
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