Small solder chip towards the new high-end, in the application of various industries to fill the technical gap

　　Solder pieceAnd flux is the key basic material of brazing link, facing the country's major strategic demand for independent control of key raw materials. It fills the research gap of green intelligent manufacturing of flux for high-end microelectronics packaging in China. The residue of flux after welding is better than that of similar foreign products, and its brazing performance reaches the international first-class level.

In high-performance electronic components, large-area brazing has been plagued by problems such as insufficient brazing penetration and many flux (flux) residues. These problems directly affect the connection reliability and electrical performance of electronic devices, and can not meet the high reliability and high integration of the new micro-system interconnection.

At the same time, the development trend of green manufacturing and intelligent manufacturing of electronic products also puts forward new requirements and challenges for brazing materials and brazing methods. In view of the problem of high oxygen impurity content in domestic welding pieces, the project team found out the method of accurately controlling oxygen element and impurity element in welding pieces by analyzing the generation mechanism of oxygen element in welding pieces, so as to realize the research and development of high-quality basic welding pieces with oxygen content less than 100 mg/L. In view of the problem that flux residue is too much and difficult to clean, the cause and mechanism of flux residue after welding are analyzed, the method of accurately controlling the amount of flux residue is obtained, and on this basis, a low-residue flux that meets the needs of high-performance electronic products is developed.

The brazing results show that the low residue flux and high-end solder chip developed by the project team have a brazing penetration rate of 99%, a flux residue area of less than 5%, and some indexes are better than similar foreign products, thus realizing the green manufacturing of high-performance electronic products.

At present, the research team is aiming at the automation and intelligent upgrading of electronic product solder chip packaging, and developing a new and efficient brazing method for electronic product components that is suitable for intelligent manufacturing, so as to solve the problem that large-area brazing cannot be automated and realize the automation, digitization and intelligence of electronic product solder chip packaging in the whole industry.