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Solder paste
HG-X100A is a lead-free and non-cleaning solder paste, which has a wide process window and low void defects. It is compatible with Sn96.5-Ag3.0-Cu0.5, Sn98.5-Ag1.0-Cu0.5 and Sn99.0-Ag0.3-Cu0.7 alloys and is suitable for reflow soldering process of precision electronic devices. This product can achieve the requirements of stable fine-pitch printing ability, and has excellent online test performance for air-raid shelters and headrest defects. HG-X100A can ensure excellent continuity of printing, anti-collapse ability, surface insulation resistance performance. Lower residue after welding can ensure the passing of ICT needle measurement. The HG-X100A has excellent anti-drying ability, can still guarantee more than 8 hours under continuous printing conditions, and the solder paste has good adhesion.
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Solder paste
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