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HG-X100A is a lead-free no-clean solder paste with a wide process window, low void defects, compatible with Sn96.5-Ag3.0-Cu0.5, Sn98.5-Ag1.0-Cu0.5 and Sn99. 0-Ag0.3-Cu0.7 alloy and other characteristics, suitable for the reflow soldering process of precision electronic devices. This product can meet the requirements of stable fine-pitch printing capability, and has excellent online testing performance for air-raid shelters and head restraint defects. HG-X100A can guarantee excellent continuous printing, collapse resistance and surface insulation resistance. The lower residue after welding can ensure the passing of the ICT pin test. HG-X100A has excellent anti-drying ability and can still guarantee more than 8 hours under continuous printing conditions. The solder paste has good adhesion.
Product number
Alloy composition
Powder size
Flux content
Sn96.5-Ag3.0-Cu0.5
Type4(20~38μm)
11.5±1wt%
Type5(15~25μm)
11.4±1wt%
Sn98.5-Ag1.0-Cu0.5
Type4(20~38μm)
11.5±1wt%
Type5(15~25μm)
11.4±1wt%
Sn99.0-Ag0.3-Cu0.7
Type4(20~38μm)
11.6±1wt%
Type5(15~25μm)
11.5±1wt%
Alloy chemical composition of solder
Composition / composition（mass%）
Alloy
Cu
Ag
Sn
Sn96.5-Ag3.0-Cu0.5
0.3~0.7
2.8~3.2
Balance
Sn98.5-Ag1.0-Cu0.5
0.3~0.7
0.8~1.2
Balance
Sn99.0-Ag0.3-Cu0.7
0.5~0.9
0.2~0.4
Balance
Chemical properties
Test items
result
Reference standard/remarks
Classification
ROL0
IPC J-STD-004
Halogen content
Br＜900ppm
EN 14582:2007
Cl＜900ppm
Br+Cl＜1500ppm
Bronze mirror test
PASS
IPC J-STD-004
Bronze board erode test
PASS
IPC J-STD-004
Electrical properties
Test items
result
Reference standard/remarks
Surface insulation resistanceSIR（IPC, 7days @85℃/85%RH）
PASS
IPC J-STD-004
(Pass means ³ 1.0´108ohms)
Surface insulation resistanceSIR (Bellcore, 96 hours @65℃/85%RH)
PASS
Bellcore GR78-CORE
(Pass means ³ 1.0´1011ohms)#c1ccd2
Electromigration (Bellcore, @65℃/85%RH 10v 500hours)
PASS
Bellcore GR78-CORE
(Pass means final>initial/10)
Number of views:
1000
Solder paste
Product number
Alloy composition
Powder size
Flux content
Sn96.5-Ag3.0-Cu0.5
Type4(20~38μm)
11.5±1wt%
Type5(15~25μm)
11.4±1wt%
Sn98.5-Ag1.0-Cu0.5
Type4(20~38μm)
11.5±1wt%
Type5(15~25μm)
11.4±1wt%
Sn99.0-Ag0.3-Cu0.7
Type4(20~38μm)
11.6±1wt%
Type5(15~25μm)
11.5±1wt%
Alloy chemical composition of solder
Composition / composition（mass%）
Alloy
Cu
Ag
Sn
Sn96.5-Ag3.0-Cu0.5
0.3~0.7
2.8~3.2
Balance
Sn98.5-Ag1.0-Cu0.5
0.3~0.7
0.8~1.2
Balance
Sn99.0-Ag0.3-Cu0.7
0.5~0.9
0.2~0.4
Balance
Chemical properties
Test items
result
Reference standard/remarks
Classification
ROL0
IPC J-STD-004
Halogen content
Br＜900ppm
EN 14582:2007
Cl＜900ppm
Br+Cl＜1500ppm
Bronze mirror test
PASS
IPC J-STD-004
Bronze board erode test
PASS
IPC J-STD-004
Electrical properties
Test items
result
Reference standard/remarks
Surface insulation resistanceSIR（IPC, 7days @85℃/85%RH）
PASS
IPC J-STD-004
(Pass means ³ 1.0´108ohms)
Surface insulation resistanceSIR (Bellcore, 96 hours @65℃/85%RH)
PASS
Bellcore GR78-CORE
(Pass means ³ 1.0´1011ohms)#c1ccd2
Electromigration (Bellcore, @65℃/85%RH 10v 500hours)
PASS
Bellcore GR78-CORE
(Pass means final>initial/10)
Product serial number
1
Product description
Parameters
Element symbol
| Cu | copper |
Zn
|
Zinc |
In
|
indium |
|
P
|
phosphorus |
Ni
|
nickel |
Sn
|
tin |
|
Ag
|
silver |
Mn
|
manganese |
Si
|
silicon |
HG-X100A is a lead-free no-clean solder paste with a wide process window, low void defects, compatible with Sn96.5-Ag3.0-Cu0.5, Sn98.5-Ag1.0-Cu0.5 and Sn99. 0-Ag0.3-Cu0.7 alloy and other characteristics, suitable for the reflow soldering process of precision electronic devices. This product can meet the requirements of stable fine-pitch printing capability, and has excellent online testing performance for air-raid shelters and head restraint defects. HG-X100A can guarantee excellent continuous printing, collapse resistance and surface insulation resistance. The lower residue after welding can ensure the passing of the ICT pin test. HG-X100A has excellent anti-drying ability and can still guarantee more than 8 hours under continuous printing conditions. The solder paste has good adhesion.
| Product number | |||
| Alloy composition | Powder size | Flux content | |
|
Sn96.5-Ag3.0-Cu0.5
|
Type4(20~38μm)
|
11.5±1wt%
|
|
|
Type5(15~25μm)
|
11.4±1wt%
|
||
|
Sn98.5-Ag1.0-Cu0.5
|
Type4(20~38μm)
|
11.5±1wt%
|
|
|
Type5(15~25μm)
|
11.4±1wt%
|
||
|
Sn99.0-Ag0.3-Cu0.7
|
Type4(20~38μm)
|
11.6±1wt%
|
|
|
Type5(15~25μm)
|
11.5±1wt%
|
||
| Alloy chemical composition of solder | |||
|
Composition / composition（mass%）
|
|||
|
Alloy
|
Cu
|
Ag
|
Sn
|
|
Sn96.5-Ag3.0-Cu0.5
|
0.3~0.7
|
2.8~3.2
|
Balance
|
|
Sn98.5-Ag1.0-Cu0.5
|
0.3~0.7
|
0.8~1.2
|
Balance
|
|
Sn99.0-Ag0.3-Cu0.7
|
0.5~0.9
|
0.2~0.4
|
Balance
|
| Chemical properties | |||
| Test items | result | Reference standard/remarks | |
|
Classification
|
ROL0
|
IPC J-STD-004
|
|
|
Halogen content
|
Br＜900ppm
|
EN 14582:2007
|
|
|
Cl＜900ppm
|
|||
|
Br+Cl＜1500ppm
|
|||
|
Bronze mirror test
|
PASS
|
IPC J-STD-004
|
|
|
Bronze board erode test
|
PASS
|
IPC J-STD-004
|
|
| Electrical properties | |||
| Test items | result | Reference standard/remarks | |
| Surface insulation resistanceSIR（IPC, 7days @85℃/85%RH） |
PASS
|
IPC J-STD-004
|
|
|
(Pass means ³ 1.0´108ohms)
|
|||
| Surface insulation resistanceSIR (Bellcore, 96 hours @65℃/85%RH) |
PASS
|
Bellcore GR78-CORE
|
|
|
(Pass means ³ 1.0´1011ohms)#c1ccd2
|
|||
| Electromigration (Bellcore, @65℃/85%RH 10v 500hours) |
PASS
|
Bellcore GR78-CORE
|
|
|
(Pass means final>initial/10)
|
|||
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Post code: 311112
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