BGA Solder balls

BGA solder balls are used for special solder balls on the soldering board before soldering the integrated circuits of the BGA package. The specific usage method is to cover the BGA tin mesh with the solder paste applied to the newly bought chip, put the BGA tin ball, blow with the hot air gun, and take out the BGA tin mesh after soldering on the chip, and use the BGA soldering station to bring the BGA tin The ball chip is soldered on the circuit board.

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Tel：0571-88780081

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Product description

Parameters

Note: All product specifications, sizes and ingredients support customization

Product number	Product ingredients	Product specifications	Melting point
SnAg2.0Cu0.5	Sn97.5% Ag2.0% Cu0.5%	0.05-0.76mm（customizable）	217-223℃
SnAg1.0Cu0.5	Sn98.5% Ag1.0% Cu0.5%	0.05-0.76mm（customizable）	217-227℃
SnAg3.0Cu0.5	Sn96.5% Ag3.0% Cu0.5%	0.05-0.76mm（customizable）	217-220℃
SnAg0.3Cu0.7	Sn99.0% Ag0.3% Cu0.7%	0.05-0.76mm（customizable）	217-227℃
Sn63Pb37	Sn63% Pb37%	0.05-0.76mm（customizable）	200-210℃
SnCu0.7	Sn99.3% Cu0.7%	0.05-0.76mm（customizable）	227℃
SnAg3.0	Sn97% Ag3%	0.05-0.76mm（customizable）	221-224℃
SnAg0.3	Sn99.7% Ag0.3%	0.05-0.76mm（customizable）	210-215℃

Nickel-based solder

Leaded tin bar/tin wire

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BGA Solder balls

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