Product Categories
Tin solder
Product number
Product ingredients
Melting point
other
6337
Sn63% Pb37%
183℃
Can be made into strips/silks
3565
Sn35% Pb65%
320-380℃
6040
Sn60% Pb40%
183-190℃
4060
Sn40% Pb60%
183-238℃
Widely used in manual dip soldering and wave soldering of military industry, precision electronic instruments, precision medical equipment, high-end electronic products, automotive electronics and other products; special tin bars/wires developed after adding trace precious metal elements for proportioning The product is also suitable for manual dip soldering and wave soldering of electronic component feet, wire materials, PCB boards and other products.
category
Product number
Product ingredients
Product specifications
Melting point
Tin
SnAg0.3Cu0.7
Sn99.0% Ag0.3% Cu0.7%
327*20.5*17.3mm
217-227℃
SnAg3.0Cu0.5
Sn96.5% Ag3.0% Cu0.5%
327*20.5*17.3mm
217-220℃
SnAg3.0
SnAg3.0
327*20.5*17.3mm
221-224℃
SnAg0.3
Sn99.7% Ag0.3%
327*20.5*17.3mm
210-215℃
SnCu0.7
Sn99.3% Cu0.7%
327*20.5*17.3mm
227℃
Tin wire
SnAg3.0Cu0.5
Sn96.5% Ag3.0% Cu0.5%
0.8~2.0mm
217-227℃
SnAg0.3Cu0.7
Sn99.0% Ag0.3% Cu0.7%
0.8~2.0mm
217-220℃
SnAg0.3
Sn99.7% Ag0.3%
0.8~2.0mm
221-224℃
SnCu0.7
Sn99.3 Cu0.7%
0.8~2.0mm
227℃
SnAg3.0
Sn97% Ag3%
0.8~2.0mm
210-215℃
BGA solder balls are used for special solder balls on the soldering board before soldering the integrated circuits of the BGA package. The specific method of use is to cover the BGA tin mesh with the solder paste applied to the newly purchased chip, place the BGA tin ball, blow with the hot air gun, and take out the BGA tin mesh after soldering on the chip, and use the BGA soldering station to bring the BGA tin The ball chip is soldered on the circuit board.
Note: All product specifications, sizes and ingredients support customization
Product number
Product ingredients
Product specifications
Melting point
SnAg2.0Cu0.5
Sn97.5% Ag2.0% Cu0.5%
0.05-0.76mm(customizable)
217-223℃
SnAg1.0Cu0.5
Sn98.5% Ag1.0% Cu0.5%
0.05-0.76mm(customizable)
217-227℃
SnAg3.0Cu0.5
Sn96.5% Ag3.0% Cu0.5%
0.05-0.76mm(customizable)
217-220℃
SnAg0.3Cu0.7
Sn99.0% Ag0.3% Cu0.7%
0.05-0.76mm(customizable)
217-227℃
Sn63Pb37
Sn63% Pb37%
0.05-0.76mm(customizable)
200-210℃
SnCu0.7
Sn99.3% Cu0.7%
0.05-0.76mm(customizable)
227℃
SnAg3.0
Sn97% Ag3%
0.05-0.76mm(customizable)
221-224℃
SnAg0.3
Sn99.7% Ag0.3%
0.05-0.76mm(customizable)
210-215℃
Widely used in manual dip soldering and wave soldering of military products, electrical and electronic products, high-end electronic products, home appliances, automotive electronics, and industrial electrical products; developed after adding a small amount of precious metal elements for proportioning The special tin bar / tin wire products are also suitable for manual dip soldering and wave soldering of electronic component feet, wire materials, PCB boards and other products.
Product number | Product ingredients | Melting point | other |
6337
|
Sn63% Pb37%
|
183℃
|
Can be made into strips/silks |
3565
|
Sn35% Pb65%
|
320-380℃
|
|
6040
|
Sn60% Pb40%
|
183-190℃
|
|
4060
|
Sn40% Pb60%
|
183-238℃
|
Widely used in manual dip soldering and wave soldering of military industry, precision electronic instruments, precision medical equipment, high-end electronic products, automotive electronics and other products; special tin bars/wires developed after adding trace precious metal elements for proportioning The product is also suitable for manual dip soldering and wave soldering of electronic component feet, wire materials, PCB boards and other products.
category | Product number | Product ingredients | Product specifications | Melting point | |
Tin |
SnAg0.3Cu0.7
|
Sn99.0% Ag0.3% Cu0.7%
|
327*20.5*17.3mm
|
217-227℃
|
|
SnAg3.0Cu0.5
|
Sn96.5% Ag3.0% Cu0.5%
|
327*20.5*17.3mm
|
217-220℃
|
||
SnAg3.0
|
SnAg3.0
|
327*20.5*17.3mm
|
221-224℃
|
||
SnAg0.3
|
Sn99.7% Ag0.3%
|
327*20.5*17.3mm
|
210-215℃
|
||
SnCu0.7
|
Sn99.3% Cu0.7%
|
327*20.5*17.3mm
|
227℃
|
||
Tin wire |
SnAg3.0Cu0.5
|
Sn96.5% Ag3.0% Cu0.5%
|
0.8~2.0mm
|
217-227℃
|
|
SnAg0.3Cu0.7
|
Sn99.0% Ag0.3% Cu0.7%
|
0.8~2.0mm
|
217-220℃
|
||
SnAg0.3
|
Sn99.7% Ag0.3%
|
0.8~2.0mm
|
221-224℃
|
||
SnCu0.7
|
Sn99.3 Cu0.7%
|
0.8~2.0mm
|
227℃
|
||
SnAg3.0
|
Sn97% Ag3%
|
0.8~2.0mm
|
210-215℃
|
BGA solder balls are used for special solder balls on the soldering board before soldering the integrated circuits of the BGA package. The specific method of use is to cover the BGA tin mesh with the solder paste applied to the newly purchased chip, place the BGA tin ball, blow with the hot air gun, and take out the BGA tin mesh after soldering on the chip, and use the BGA soldering station to bring the BGA tin The ball chip is soldered on the circuit board.
Note: All product specifications, sizes and ingredients support customization
Product number | Product ingredients | Product specifications | Melting point |
SnAg2.0Cu0.5
|
Sn97.5% Ag2.0% Cu0.5%
|
0.05-0.76mm(customizable)
|
217-223℃
|
SnAg1.0Cu0.5
|
Sn98.5% Ag1.0% Cu0.5%
|
0.05-0.76mm(customizable)
|
217-227℃
|
SnAg3.0Cu0.5
|
Sn96.5% Ag3.0% Cu0.5%
|
0.05-0.76mm(customizable)
|
217-220℃
|
SnAg0.3Cu0.7
|
Sn99.0% Ag0.3% Cu0.7%
|
0.05-0.76mm(customizable)
|
217-227℃
|
Sn63Pb37
|
Sn63% Pb37%
|
0.05-0.76mm(customizable)
|
200-210℃
|
SnCu0.7
|
Sn99.3% Cu0.7%
|
0.05-0.76mm(customizable)
|
227℃
|
SnAg3.0
|
Sn97% Ag3%
|
0.05-0.76mm(customizable)
|
221-224℃
|
SnAg0.3
|
Sn99.7% Ag0.3%
|
0.05-0.76mm(customizable)
|
210-215℃
|
Tel: 18594983359
Mail: Firmkim@cn-huaguang.com
Post code: 311112
Add: No. 82, Qihang Road, Renhe Street, Yuhang District, Hangzhou City, Zhejiang Province
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