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Copper-based brazing paste
Copper-based solder paste is made of alloy solder powder with copper and phosphorus as the main elements, adding active flux and binder independently developed by Fujing, which has the characteristics of good fluidity and excellent process performance. In addition, the addition of silver to the copper-phosphorus alloy will greatly improve the wetting ability of the solder, improve the strength and toughness, and reduce the melting point. This kind of solder has low brazing temperature and self-brazing function. Phosphorus-containing copper-based solder paste is suitable for brazing copper, copper alloy, silver alloy, etc. The solder paste has good wettability with the welded base metal and excellent welding strength. However, the copper-based solder paste containing phosphorus has poor wettability to metal alloys such as iron or nickel, and is easy to form brittle phosphide at the joint, which increases the brittleness of the joint. It is recommended to use other types of solder paste.
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Copper-based brazing paste
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