Solder application: How many cattle are filled with metal materials
Release time:
2022-07-12
【Summary Description】 A solder (or brazing filler metal) is a material that is used as a filler metal at the time of brazing. After heating and melting, the solder infiltrates the base metal, fills the joint gap, and diffuses with the base metal to realize the brazing connection. Solder, as an interconnection material in electronic packaging technology, mainly undertakes the functions of mechanical connection, electrical connection and heat dissipation, and is used in all levels of electronic packaging. Solder is mainly used for lead welding, chip welding, shell sealing, etc. 1. Solder performance requirements for integrated circuit packaging In order to meet the requirements of brazing process and brazing joint performance, the solder used as the connecting material should generally meet the following basic requirements. (1) It has a suitable melting point, which must be lower than the melting temperature of the base material to be welded. (2) It has good wetting characteristics and spreading characteristics for the base metal, and can achieve proper dissolution and diffusion with the base metal. (3) The welding interface should have certain mechanical strength and stable physical and chemical properties. (4) The price is moderate, and the content of rare metals and precious metals is low. 2. Material system of solder The traditional solder is lead-tin (Sn-Pb) solder, its material system is stable, low melting point (63Sn-37Pb eutectic solder melting point of 183 degrees), with excellent welding performance, processing performance and low price, so it has been widely used.
A solder (or brazing filler metal) is a material that is used as a filler metal at the time of brazing. After heating and melting, the solder infiltrates the base metal, fills the joint gap, and diffuses with the base metal to realize the brazing connection. Solder, as an interconnection material in electronic packaging technology, mainly undertakes the functions of mechanical connection, electrical connection and heat dissipation, and is used in all levels of electronic packaging. Solder is mainly used for lead welding, chip welding, shell sealing, etc.
1. Solder performance requirements for integrated circuit packaging
In order to meet the requirements of brazing process and brazing joint performance, the solder used as the connecting material should generally meet the following basic requirements.
(1) It has a suitable melting point, which must be lower than the melting temperature of the base material to be welded.
(2) It has good wetting characteristics and spreading characteristics for the base metal, and can achieve proper dissolution and diffusion with the base metal.
(3) The welding interface should have certain mechanical strength and stable physical and chemical properties.
(4) The price is moderate, and the content of rare metals and precious metals is low.
2. Material system of solder
The traditional solder is lead-tin (Sn-Pb) solder, its material system is stable, low melting point (63Sn-37Pb eutectic solder melting point of 183 degrees), with excellent welding performance, processing performance and low price, so it has been widely used.
Related News
Telephone:+86-18594983359
E-mail:Firmkim@cn-huaguang.com
Zip Code: 311112
Address: No. 82, Qihang Road, Renhe Street, Yuhang District, Hangzhou City, Zhejiang Province
Douyin QR code
We chat number
WeChat public account