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Soldering Process of Solder Attachable Connectors

Release time:

2022-07-12

【Summary Description】 Soldering reliability of solder mounted connectors is higher than that of traditional surface mount BGA and CGA devices. This type of connector structure has been widely used by many connector manufacturers.

Soldering reliability of solder mounted connectors is higher than that of traditional surface mount BGA and CGA devices. This type of connector structure has been widely used by many connector manufacturers.

With the increasing demand for miniaturization of electronic equipment, the use of surface mount connectors is becoming more and more widespread. While meeting the requirements of high-density assembly of electronic equipment, the reliability of the solder connection between the traditional BGA, CGA and other surface mount connectors and the printed board has been widely concerned. In order to improve the reliability of surface mount connector solder joints, the traditional surface mount connector solder end structure has been gradually replaced by a new type of solder attachment structure in foreign countries.

Solder-mounted connectors shall be mounted to ensure that all solder contacts of the connector are in full contact with the printed board pads. To ensure one-time placement, it is recommend to use an automatic placement machine to place solder-mount connectors. Due to the accuracy of the connector solder attachment and the difference in the flatness of the printed board, it is not easy to meet all the solder contact points and the printed board pad, so the gap between the connector and the printed board is required to be as small as possible when mounting.

When the welding quality of individual solder joints of solder-mounted connectors does not meet the requirements, corresponding repair measures shall be taken to ensure that the welding quality of the solder joints meets the requirements.

 

If the defective solder joints are only on the outside of the connector, during rework, first protect the adjacent devices around the solder-attached connector with thermal isolation tape to prevent high-temperature hot air from affecting the solder joints of these devices during rework. Subsequently, use a small brush dipped in a small amount of rosin to apply to the area where the unqualified solder joint is located. Next, use the hot air gun to move the heating in a circle along the area of the unqualified welding point to avoid damage to the connector and printed circuit board. Finally, with the help of rosin, the unqualified solder joints are easily welded.

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